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INTEGRATED CIRCUITS
DATA SHEET
PCD5032 ADPCM CODEC for digital cordless telephones
Product specification Supersedes data of August 1993 File under Integrated Circuits, IC17 1997 Apr 03
Philips Semiconductors
Product specification
ADPCM CODEC for digital cordless telephones
CONTENTS 1 2 3 4 5 6 7 7.1 7.1.1 7.1.2 7.1.3 7.1.4 7.2 7.2.1 7.2.2 7.2.3 7.3 7.3.1 7.3.2 7.3.3 7.3.4 8 9 10 11 12 13 14 14.1 14.2 14.3 14.3.1 14.3.2 14.3.3 14.4 15 16 17 FEATURES APPLICATIONS GENERAL DESCRIPTION ORDERING INFORMATION BLOCK DIAGRAM PINNING FUNCTIONAL DESCRIPTION Digital interfaces ADPCM interface PCM interface I2C-bus interface Fast mute Analog parts and I2C-bus programming Input and output Sidetone Tone generator and ringer Modes of operation Standby mode Active mode Test loops Reset HANDLING LIMITING VALUES DC AND AC CHARACTERISTICS FILTER CHARACTERISTICS APPLICATION INFORMATION PACKAGE OUTLINES SOLDERING Introduction Reflow soldering Wave soldering QFP SO Method (QFP and SO) Repairing soldered joints DEFINITIONS LIFE SUPPORT APPLICATIONS PURCHASE OF PHILIPS I2C COMPONENTS
PCD5032
1997 Apr 03
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Philips Semiconductors
Product specification
ADPCM CODEC for digital cordless telephones
1 FEATURES 2 APPLICATIONS
PCD5032
* G.721 compliant ADPCM encoding and decoding * `Bitstream' analog-to-digital and digital-to-analog conversion * On-chip receive and transmit filter * On-chip ringer and tone generator * Programmable gain of receive and transmit path * Serial ADPCM interface with independent timing for maximum flexibility * Linear PCM data accessible for digital echo cancelling * Programmable via I2C-bus interface * Fast receiver mute input via pin * On-chip reference voltage * On-chip symmetrical supply for electret microphone * Few external components * Low power consumption in standby mode * Low supply voltage (single supply 2.7 V up to 5.5 V) * CMOS technology * Minimized EMC on digital outputs. 4 ORDERING INFORMATION TYPE NUMBER PCD5032H PCD5032T
* Digital Enhanced Cordless Telephony (DECT) * CT2 cordless * Speech compression. 3 GENERAL DESCRIPTION
The PCD5032 is a CMOS device designed for use in Digital Enhanced Cordless Telephone systems (DECT), but also suitable for other cordless telephony applications such as CT2. The PCD5032 performs analog-to-digital and digital-to-analog conversion, ADPCM encoding and decoding compliant to CCITT recommendation "G.721 (blue book, 1988)". The PCD5032 contains on-chip microphone and earpiece amplifiers. The device can be used in both handset and base station designs.
PACKAGE NAME QFP44 SO28 DESCRIPTION plastic quad flat package; 44 leads (lead length 2.35 mm); body 14 x 14 x 2.2 mm plastic small outline package; 28 leads; body width 7.5 mm VERSION SOT205-1 SOT136-1
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3
5
andbook, full pagewidth
1997 Apr 03 BLOCK DIAGRAM
PO RPI VDD TEST RESET 3 26 20 22 19 V REF- VGA V REF+ 30 1 6 4
Philips Semiconductors
TPE
RPE
9
CLK
34
CLOCK AND SYNC
PCD5032
VOLTAGE AND CURRENT REFERENCE
RAS 25 LOW PASS FILTER 23 VOLUME CONTROL volume gain level SIDETONE tone DIGITAL FILTER NOISE SHAPER 1-BIT DAC
41 RE+ RE-
RAD
42
ADPCM DECODER
ADPCM CODEC for digital cordless telephones
DCLK
36
TAS
39
TAD
37
ADPCM DECODER
4
TX mute DIGITAL FILTER 1-BIT DAC tone select TONE GENERATOR 28 frequency/ volume 8 TPI RINGER VSS
loop
RX mute
15 17 gain 33 31
TM+ TM-
RFM
44
SDA
12
I 2 C - BUS
INTERFACE
SCL
11
BZ+ BZ-
14
MEA786
A0
Product specification
PCD5032
Fig.1 Block diagram (pin numbers are for QFP44 package).
Philips Semiconductors
Product specification
ADPCM CODEC for digital cordless telephones
6 PINNING PIN(1)(2) SYMBOL QFP44 RESET n.c. RPE RPI n.c. PO n.c. TPI TPE n.c. SCL SDA n.c. A0 TM+ n.c. TM- n.c. VREF- VREF+ n.c. VGA RE- n.c. RE+ VDD n.c. VSS n.c. TEST BZ- n.c. BZ+ CLK n.c. 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 33 34 35 SO28 4 - 5 6 - 7 - 8 9 - 10 11 - 12 13 - 14 - 15 16 - 17 18 - 19 20 - 21 - 22 23 - 24 25 - I - O I - O - I O - I I - I I - I - O O - O O - O P - P - I O - O I - reset input; active HIGH not connected TYPE DESCRIPTION
PCD5032
receiver PCM output enable (active LOW); direction from ADPCM interface to earpiece receiver PCM input; direction from ADPCM interface to earpiece not connected PCM data output not connected transmitter PCM input; direction from microphone to ADPCM interface transmitter PCM output enable (active LOW); direction from microphone to ADPCM interface not connected serial clock input; I2C-bus serial data input; I2C-bus not connected address select input; I2C-bus transmitter audio positive input (microphone) not connected transmitter audio negative input (microphone) not connected negative reference voltage output; internally generated, intended for electret microphone supply positive reference voltage output; internally generated, intended for electret microphone supply not connected analog signal ground output receiver audio negative output (earpiece) not connected receiver audio positive output (earpiece) positive supply voltage (2.7 V to 5.5 V) not connected negative supply voltage (0 V) not connected test mode input; to be connected to VSS in normal application ringer negative output not connected ringer positive output clock input not connected
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Philips Semiconductors
Product specification
ADPCM CODEC for digital cordless telephones
PIN(1)(2) SYMBOL QFP44 DCLK TAD n.c. TAS n.c. RAS RAD n.c. RFM Notes 1. QFP44 package: Pins 1, 3, 4, 6, 8, 9, 11, 12, 14, 30, 34, 36, 37, 39, 41, 42 and 44 are digital pins. Pins 15, 17, 23, 25, 31 and 33 are analog pins. Pins 19, 20, 22, 26, and 28 are general pins. 2. SO28 package: Pins 1, 2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 22, 25, 26, 27 and 28 are digital pins. Pins 13, 14, 18, 19, 23 and 24 are analog pins. Pins 15, 16, 17, 20 and 21 are general pins. 36 37 38 39 40 41 42 43 44 SO28 26 27 - 28 - 1 2 - 3 I O - I - I I - I data clock input (ADPCM) TYPE DESCRIPTION
PCD5032
transmitter ADPCM data output; direction from microphone to ADPCM interface not connected transmitter ADPCM sync input; direction from microphone to ADPCM interface not connected receiver ADPCM sync input; direction from ADPCM interface to earpiece receiver ADPCM data input; direction from ADPCM interface to earpiece not connected receiver fast mute input; direction from ADPCM interface to earpiece
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Philips Semiconductors
Product specification
ADPCM CODEC for digital cordless telephones
DCLK
PCD5032
RFM
RAD
41 RAS
37 TAD
39 TAS
handbook, full pagewidth
44
40
43
42
38
36
35
RESET n.c RPE RPI n.c. PO n.c. TPI TPE n.c. SCL
1 2 3 4 5 6 7 8 9 10 11
34
CLK
n.c.
n.c.
n.c.
n.c.
33 BZ+ 32 n.c. 31 BZ- 30 TEST 29 n.c.
PCD5032H
28 V SS 27 n.c. 26 V DD 25 RE+ 24 n.c. 23 RE-
MEA787
SDA 12
13
14
15
16
17
18
19
20
21 n.c.
A0
TM+
TM-
VREF-
n.c.
n.c.
n.c.
VREF+
Fig.2 Pin configuration QFP44 (SOT205-1).
handbook, halfpage
RAS 1 RAD 2 RFM 3 RESET 4 RPE 5 RPI 6 PO 7
28 TAS 27 TAD 26 DCLK 25 CLK 24 BZ+ 23 BZ- 22 TEST
PCD5032T
TPI 8 TPE 9 SCL 10 SDA 11 A0 12 TM+ 13 TM- 14
MGK070
21 VSS 20 VDD 19 RE+ 18 RE- 17 VGA 16 VREF+ 15 VREF-
Fig.3 Pin configuration SO28 (SOT136-1).
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VGA
22
Philips Semiconductors
Product specification
ADPCM CODEC for digital cordless telephones
7 7.1 7.1.1 FUNCTIONAL DESCRIPTION Digital interfaces ADPCM INTERFACE
PCD5032
For the receive direction the PCM data is output on pin PO and read from pin RPI. For the transmit direction the PCM data is output on pin PO and read from pin TPI. To enable bus structures to be used in base stations the PCM output PO is in high-impedance state when not active. Inputs TPI and RPI have internal pull-down. In a typical handset application, pin PO is directly connected to RPI and TPI. If additional data processing is required (echo cancellation in a base station, for example), a data processing unit may be placed between PO and RPI or between PO and TPI. The data format is serial, 2's complement, MSB first. PO outputs 16 bits (14 data bits followed by 2 zeroes). TPI and RPI read 14 data bits. The bit frequency is 3456 kHz (CLK). Data output PO changes on the falling edge of CLK (see Figs. 5 and 6). For interfacing to digital signal processors, signals TPE and RPE (both active LOW) mark the position of the transmit and receive PCM data on pin PO (see Fig.7). TPE and RPE change on the rising edge of CLK. Outputs RPE and TPE have low impedance only from half a CLK cycle after the active state. The rest of the time they are in high impedance state. Thus a wired-OR configuration can be made when only one DSP serial input port is used for reading both transmit and receive data. An external pull-up is required.
The ADPCM receive and transmit data pins, RAD and TAD, carry 4-bit words of serial data. The received and transmitted data are controlled separately by the synchronization pins RAS and TAS. On detection of a HIGH level on RAS (with a rising edge on DCLK), the receiver will read 4 ADPCM bits on the next 4 HIGH-to-LOW transitions of DCLK. Likewise, on reception of a HIGH level on TAS, the transmitter will output 4 ADPCM bits on the next 4 LOW-to-HIGH transitions of DCLK. Figure 4 is the ADPCM timing diagram. During the time that the ADPCM data output (TAD) is not activated, it will be in a high-impedance state, enabling a bus structure to be used in a multi-line base station. Input RAD has an internal pull-down resistor. The minimum frequency on the DCLK input is 154fCLK. The maximum value equals the clock frequency, and any value in between may be chosen. The RAS signal controls the start of each conversion in a frame at an 8 kHz rate. The master clock `CLK' must be locked to the frequency of `RAS', with a ratio fCLK = 432 x fRAS. 7.1.2 PCM INTERFACE
To enable additional data processing in a base station both transmit and receive linear PCM data paths are accessible.
handbook, DCLK full pagewidth
RAS/TAS
RAD/TAD
01 MSB
02
03
04 LSB
MGK073
Fig.4 ADPCM timing.
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Philips Semiconductors
Product specification
ADPCM CODEC for digital cordless telephones
PCD5032
handbook, full pagewidth
CLK
RPE/TPE
PO RPE/TPE low impedance
01 MSB
02
03
04
05
06
07
08
09
10
11
12
13
14 LSB
15
16
MGK075
Fig.5 PCM output timing.
handbook, full pagewidth
CLK
RPE/TPE
PO RPI/TPI low impedance
01 MSB
02
03
04
05
06
07
08
09
10
11
12
13
14 LSB
MGK076
Fig.6 PCM input timing.
handbook, full pagewidth
RAS
TPE RPE 16 BITS TX TPI 14 BITS 16 BITS RX
PO
RPI 163 CLK CYCLES 81 CLK CYCLES
14 BITS 188 CLK CYCLES
MGK074
Fig.7 PCM timing.
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Philips Semiconductors
Product specification
ADPCM CODEC for digital cordless telephones
7.1.3 I2C-BUS INTERFACE
PCD5032
With the address select pin A0 it is possible to have two independently programmed PCD5032 CODECs in a base station (two outside lines). If more CODECs are used in a base station then the address pin can be used as a select signal. Detailed description of the I2C-bus specification is given in the brochure "The I2C-bus and how to use it". This may be ordered using the code 9398 393 40011. Each function can be accessed by writing one 8-bit word to the ADPCM CODEC. For this reason the 8-bit word is divided into two fields: * bit 7, bit 6: function * bit 5 to bit 0: value/setting. Table 1 gives an overview of the I2C-bus programming options.
The mode of operation and transmitter/receiver gain is programmed through the I2C-bus serial interface. The I2C-bus address of the device is shown in Fig.8.
handbook, halfpage
0
0
1
1
0
0
A0
0 (WRITE ONLY)
MGK071
Fig.8 I2C-bus address.
Table 1
Overview of I2C-bus programming options BIT 7 0 0 1 1 0 1 0 1 BIT 6 - RV2 ST1 BF2 BIT 5 - RV1 ST0 BF1 BIT 4 BIT 3 TONE RV0 MUTE BF0 BIT 2 PON RG2 TG2 BV2 BIT 1 T1 RG1 TG1 BV1 BIT 0 T0 RG0 TG0 BV0
FUNCTION Operation mode Receiver control Transmitter control Ringer Table 1 definitions:
* TONE: `tone/ringer' section for tone generator output; tones can be sent to ringer or receiver DAC * PON: power-on (active) * T1 and T0: test loops * RG2 to RG0: receiver gain * TG2 to TG0: transmitter gain * RV2 to RV0: receiver volume * BV2 to BV0: tone volume * BF2 to BF0: tone frequency * ST1 to ST0: sidetone level. Programming the ADPCM CODEC is possible in active mode as well as in standby mode. A reset clears all I2C-bus registers. 7.1.4 FAST MUTE
blanked, so that the ADPCM decoder output signal goes to zero. To ensure immediate silence on the analog outputs RE+ and RE-, the linear PCM input data of the receive filter is set to zero as well. If the mute signal is switched off again, then the ADPCM decoder output settles gradually from the zero to the appropriate PCM signal level. No audible clicks will occur. The sidetone level is not affected by the mute function. 7.2 7.2.1 Analog parts and I2C-bus programming INPUT AND OUTPUT
The analog input pins TM+ and TM- can be connected directly to a microphone. For electret microphones capacitive coupling is required (see Chapter 12, Fig.13). The earpiece must be a low-ohmic device (>100 differential). The microphone and earpiece amplifiers have the possibility of gain control via the I2C-bus interface. Further the sending and receiving direction can be muted separately. Analog gain control for the receive path can be set in steps of 1 dB. Digital volume control can be set in 6 dB steps. Table 2 gives an overview of the gain control options. 10
The RFM (Receiver Fast Mute) pin enables fast muting of the received signal if erroneous data is present on the ADPCM interface. Muting is done in the same way as the receiver mute via the I2C-bus. The input data of the ADPCM decoder is 1997 Apr 03
Philips Semiconductors
Product specification
ADPCM CODEC for digital cordless telephones
Table 2 Overview of gain control options I2C-CODE GAIN -3 dB -2 dB -1 dB 0 dB +1 dB +2 dB +3 dB +4 dB 0 dB -6 dB -12 dB -18 dB -24 dB -30 dB -36 dB RX MUTE -3 dB -2 dB -1 dB 0 dB +1 dB +2 dB +3 dB +4 dB TX MUTE default OFF default Frequency default Table 4 default 1001XXXX 1010XXXX 1011XXXX NOTE Table 3 Sidetone level options I2C-CODE 1000XXXX
PCD5032
FUNCTION
FUNCTION Sidetone
OPTION No local sidetone Level = -12 dB Level = -18 dB Level = -24 dB
NOTE default
Receiver 01XXX101 gain (relative) 01XXX110 01XXX111 01XXX000 01XXX001 01XXX010 01XXX011 01XXX100 Receiver volume 01000XXX 01001XXX 01010XXX 01011XXX 01100XXX 01101XXX 01110XXX 01111XXX Transmitter 10XXX101 gain (relative) 10XXX110 10XXX111 10XXX000 10XXX001 10XXX010 10XXX011 10XXX100 Transmitter mute 7.2.2 10XX1XXX
Tone output frequency/volume options I2C-CODE 11XXX000 11XXX001 11XXX010 11XXX011 11XXX100 11XXX101 11XXX110 11XXX111 11000XXX 11001XXX 11010XXX 11011XXX 11100XXX 11101XXX 11110XXX 11111XXX OPTION Signal off -29 dB -23 dB -17 dB -11 dB -5 dB -0 dB +4 dB 400 Hz 421 Hz 444 Hz 800 Hz 1000 Hz 1067 Hz 1333 Hz 2000 Hz NOTE default sinewave sinewave sinewave sinewave sinewave sinewave squarewave
FUNCTION Volume (relative)
SIDETONE
With the I2C-bus interface the (local) sidetone level can be set to -12, -18, -24 dB, or switched off. See Table 3. The sidetone level is independent of the receiver volume control setting. 7.2.3 TONE GENERATOR AND RINGER
The ringer output (BZ) is differential and is intended for low-ohmic devices. If the ringer is switched off then both outputs are low. The output signal is a pulse density modulated block wave (on a 32 kHz basic pulse rate) to generate a sinewave-like output signal, see Fig.9. Volume is controlled by changing the pulse width of each pulse. In the square wave mode a full square wave is generated and results in the maximum volume. The volume settings (in dB) are given for the first harmonic signal component.
The PCD5032 contains a programmable tone generator which can be used for generating ringer tones (BZ+, BZ-) or local information tones in the receive path (RE+, RE-). By setting the TONE bit (bit 3) in the operation mode register, the tone output will be directed to the receiver DAC, otherwise the tones will be sent to the ringer output stage. Table 4 shows the possible frequency and volume settings. 1997 Apr 03 11
Philips Semiconductors
Product specification
ADPCM CODEC for digital cordless telephones
7.3 Modes of operation 7.3.3 TEST LOOPS
PCD5032
The ADPCM CODEC has a `Standby mode', an `Active mode' and three operating modes: `Normal mode' and two loop modes. Table 5 gives details of setting the various modes via the I2C-bus. 7.3.1 STANDBY MODE
Both test loops can be used for test or evaluation purposes. Loop 1 is intended for testing the audio path and A/D, D/A converters, the ADPCM transcoder is not addressed in this mode. The ADPCM data is directly looped back towards the radio interface. The PCM data is looped from transmit filter output to receive filter input. Loop 2 is intended for testing the audio path including ADPCM encoding and decoding. 7.3.4 RESET
After a reset the ADPCM CODEC will by default be in standby mode. All I2C-bus settings will be cleared. Standby mode can also be explicitly set using the code shown in Table 5. In standby mode all circuits are switched off, except for the I2C-bus interface. Before going to standby mode the PCD5032 performs a reset of the ADPCM transcoder, digital filters and auxiliary logic functions. The I2C-bus interface registers are not cleared. 7.3.2 ACTIVE MODE
Active mode is set using the code shown in Table 5. Once active mode has been set, the ADPCM CODEC is by default in normal mode, but can explicitly be set to one of the two test loops or back to normal mode using the codes shown in Table 5. Table 5 Modes of operation FUNCTION Standby mode Active mode Normal mode Loop 1 Loop 2 I2C-CODE 00XXX0XX 00XXX1XX 00XXXX00 00XXXX01 00XXXX10 Power-down Active
After an external reset pulse the circuit will perform an internal reset procedure. The reset pulse must be active for at least 10 CLK cycles. 125 s (the duration of 1 cycle at 8 kHz) after RESET has gone LOW, the internal reset is completed and the PCD5032 goes into standby mode. At that moment the ADPCM CODEC is ready to be programmed. A reset clears all I2C-bus registers and resets the ADPCM transcoder, digital filters and auxiliary logic functions.
DESCRIPTION
NOTE default after reset default after active mode set
Normal operation Loopback on ADPCM side and on PCM side without using ADPCM transcoder Loopback on TM+/TM- through ADPCM transcoder
handbook, full pagewidth 0
0 1 0 1 0 1 1 1 1 0 1 0 1 0 0 0 0 -1 0 -1 0 -1 -1 -1 -1 0 -1 0 -1 0 0 +VDD 0 -VDD
MGK072
Fig.9 Tone output example.
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Philips Semiconductors
Product specification
ADPCM CODEC for digital cordless telephones
8 HANDLING
PCD5032
Inputs and outputs are protected against electrostatic discharge in normal handling. However, it is good practice to take normal precautions appropriate to handling MOS devices. Details of recommended precautions are given in "Handling MOS devices", which is published in the General Information section of several of Philips data handbooks. 9 LIMITING VALUES In accordance with the Absolute Maximum Rating System (IEC 134). SYMBOL VDD IDD VI II supply voltage supply current all input voltages DC input current BZ+, BZ- RE+, RE- all other pins IO DC output current BZ+, BZ- RE+, RE- all other pins Ptot Tstg Tamb total power dissipation storage temperature operating ambient temperature -150 -50 -10 - -65 -25 +150 +50 +10 500 +150 +70 mA mA mA mW C C -150 -50 -10 +150 +50 +10 mA mA mA PARAMETER MIN. -0.5 -150 -0.5 MAX. +6.5 +150 VDD + 0.5 V mA V UNIT
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Philips Semiconductors
Product specification
ADPCM CODEC for digital cordless telephones
PCD5032
10 DC AND AC CHARACTERISTICS VDD = 2.7 to 5.5 V; VSS = 0 V; CLK = 3456 kHz; Tamb = -25 to +70 C; all voltages with respect to VSS; unless otherwise specified. Specifications valid in active mode, except standby supply current. SYMBOL General VDD IDD Istb ILI VGA VREF+ VREF- Digital I/O VIL VIH VOL VOH Rpd(int) fDCLK fRAS, fTAS LOW level input voltage HIGH level input voltage LOW level output voltage HIGH level output voltage internal pull-down resistance DCLK frequency RAS, TAS frequency note 3 note 3 note 3 note 3 note 3 note 4 note 4 0 0.7VDD - VDD -o.4 -
1 54fCLK
PARAMETER
CONDITIONS
MIN. - 7
TYP.
MAX.
UNIT
operating supply voltage operating supply current standby supply current input leakage current analog signal ground voltage positive reference voltage negative reference voltage note 2 note 2 no load; Tamb = 25C; note 1 Tamb = 25C; note 1 VSS VI VDD
2.7 - - -1 0.48VDD 0.8 -0.8
5.5 14 100 +1 1.2 -1.2
V mA A A V V
20 - 0.5VDD 1.0 -1.0 - - - - 150 = 64 - 8 - - - - - - - - - - - -
0.52VDD V
0.3VDD VDD 0.4 VDD - fCLK -
V V V V k kHz kHz
- - - 4.7 4.7 4.0 4.7 4.0 - - 250 0 4.0 - - - - -4 +3
I2C-bus timing fSCL tSW tBUF tSU;STA tHD;STA tLOW tHIGH tr tf tSU;DAT tHD;DAT tSU;STO Zi(TM+) Zi(TM-) Vi Vi(max) Gv(min) Gv(max) SCL clock frequency tolerable pulse spike width bus free time set-up time repeated START hold time START condition SCL LOW time SCL HIGH time rise time SDA and SCL fall time SDA and SCL data set-up time data hold time set-up time STOP condition 100 50 - - - - - 1.0 0.3 - - - - - - - -2 +5 kHz ns s s s s s s s ns ns s
Analog inputs; note 5 input impedance, TM+ input impedance, TM- nominal input level maximum input signal minimum voltage gain maximum voltage gain note 6 note 6 RMS value; note 7 RMS value; note 8 125 125 12 56 -3 +4 k k mV mV dB dB
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Philips Semiconductors
Product specification
ADPCM CODEC for digital cordless telephones
SYMBOL Gv(step) THDTX PARAMETER voltage gain, step size total harmonic distortion (transmitted) note 9 CONDITIONS - - MIN. 1 - TYP.
PCD5032
MAX. - -40
UNIT dB dB
Receiver audio output Zo Vo(rms) Gv(min) Gv(max) Gv(step) Gvol Gvol(step) THDRX output impedance output signal level (RMS value) minimum voltage gain maximum voltage gain voltage gain, step size volume control range volume step size total harmonic distortion (received) note 12 note 6 0 dBm0; note 10 3.14 dBm0; note 11 - - - -4 +3 - -36 - - 10 550 1250 -3 +4 1 - 6.0 - - - - -2 +5 - 0 - -40 mV mV dB dB dB dB dB dB
Ringer output; notes 5 and 13 Zo Gvol Notes 1. All outputs left open. IDD measured with all inputs connected to VSS, except: CLK and DCLK connected to 3.456 MHz; RAS and TAS connected to 8 kHz. Istb measured with all inputs connected to VSS, except: TM+, TM- left open. 2. The reference voltage is available on VREF+ and VREF- and is measured with respect to VGA. The voltage outputs are intended for electret microphone supply and can deliver 400 A. 3. Digital inputs and outputs are CMOS-levels compatible. The outputs and inputs can sink or source 1 mA. Pull-down resistors are present at pins RPI, TPI, TEST, RAD. 4. Any frequency between min. and max. is allowed for DCLK. The signals CLK and RAS/TAS must be frequency-locked and will have a ratio of fCLK/fRAS = 432 5. All analog input/output voltages are measured differentially. The circuit is designed for use with an electret microphone. 6. Frequency band is 300 Hz to 3400 Hz. Maximum load capacitance = 100 pF differentially, or 200 pF each pin. 7. Nominal signal level gives -10 dBm0 on the PCM interface (G.711/G.712). Value given for TX gain setting 0 dB. 8. Nominal signal level gives 3.14 dBm0 on the PCM interface, with larger input signals the digital output will be saturated. Value given for TX gain setting 0 dB. 9. Transmitter gain setting = 0 dB and input signal level = 40 mV (RMS) (will generate 0 dBm0 on PCM interface according to G.711). 10. PCM signal level is 0 dBm0 and RX gain setting 0 dB. With a load of 300 between RE+ and RE- the signal level results in an output power of 1 mW. The maximum output current is 10 mA. 11. PCM signal level is +3.14 dBm0 and RX gain setting +4 dB. The maximum output current is 10 mA. 12. PCM signal level is 0 dBm0 (G.711). 13. For maximum output power the load resistance should equal the typical output impedance (specified at ILOAD -20 mA). The absolute maximum value of output power given in Chapter 9 defines the minimum load resistance. output impedance volume control range - -29 14 - 29 +4 dB
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Philips Semiconductors
Product specification
ADPCM CODEC for digital cordless telephones
11 FILTER CHARACTERISTICS VDD = 2.7 to 5.5 V; VSS = 0 V; Tamb = -25 to +70 C. SYMBOL Transmitter RPB passband ripple (300 to 3000 Hz) frequency response f = 50 Hz f = 3400 Hz f = 4600 Hz f = 8000 Hz Analog-to-Digital converter S/N signal-to-noise ratio Fig.10; notes 1 and 2 35 - - - - tbf - -35 -35 -35 -60 - - - - - PARAMETER CONDITIONS MIN. TYP.
PCD5032
MAX.
UNIT
0.5 -2 -2 -2 -2 - -
dB dB dB dB dB
dB
Digital-to-Analog converter S/N signal-to-noise ratio Fig.10; notes 1 and 2 35 - - tbf dB s s s
Group delay td(TX) td(RX) td(g) Notes 1. Frequency band is 300 Hz to 3400 Hz. Maximum load capacitance = 100 pF differentially, or 200 pF each pin. 2. Measured with psophometric filter (CCITT G.223). Only fulfilled at VDD noise level less than 40 mV (peak value) (0 to 20 kHz). Measured on sample basis at VDD = 3.0 V,Tamb = 25 C, compliant with G.712. Signal level is -40 dBm0 on PCM interface; 0.4 mV (RMS) on analog input. Gain setting is 0 dB. 3. Group delay includes ADPCM/PCM conversion; signal frequency = 1.5 kHz. Value given is for RAS/TAS signals asserted simultaneously. transmitter receiver group delay distortion (Loop 1) note 3 note 3 Fig.11 400 525 tbf
handbook, halfpage
80 70 60 50 40 33 30 27 22 20 10 0 -70 -60 -50 -40 -30 -20 -10 0 +10 input level (dBm0)
MGK078
1.75 ms handbook, halfpage td(g) 1.5 ms
S/(N + THD)
1.25 ms 1.0 ms 750.0 s 500.0 s CCITT G.712
G.712
250.0 s 0.0 300 600 1000 500 1500 frequency (Hz) 2600 2800 3400
MGK077
Fig.10 Typical performance of AD and DA in cascade.
Fig.11 Group delay distortion: Transmit and Receive (loop measurement).
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Philips Semiconductors
Product specification
ADPCM CODEC for digital cordless telephones
12 APPLICATION INFORMATION
PCD5032
13824 kHz crystal
handbook, full pagewidth
1.9 GHz control RECEIVER data RSSl BURST MODE CONTROLLER (PCD5040) control TRANSMITTER DCLK ADPCM CODEC (PCD5032) sync earpiece
data CLK
microphone
data
ringer
RF SECTION
3
2
modulator out VCO output
microcontroller bus
MICROCONTROLLER
I2C bus
SYNTHESIZER f REF
LCD DISPLAY KEYBOARD
MEA788
Fig.12 Typical block diagram for a DECT handset.
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Philips Semiconductors
Product specification
ADPCM CODEC for digital cordless telephones
PCD5032
handbook, full pagewidth
TPE CLK RAS RAD burst mode controller DCLK TAS TAD RFM 9 34 41 42 36 39 37 44 3
RPE 8
TPI 4
RPI 6
PO BZ+ buzzer 31 BZ-
33
25
RE+ loudspeaker
23
RE-
PCD5032
20
V REF+
100 1 k
15
TM+ 47 F
100 nF
microphone
TM- 17
100 nF SDA microcontroller SCL RESET 11 1 26 VDD 100 nF 2.7 to 5.5 V 47 F
MEA789
12
19
VREF- 100 nF
100 100 nF
1k
22 28 V SS 30 14 TEST A0
VGA
47 F
Fig.13 Typical handset application diagram for the PCD5032 in QFP44 package.
1997 Apr 03
18
Philips Semiconductors
Product specification
ADPCM CODEC for digital cordless telephones
13 PACKAGE OUTLINES QFP44: plastic quad flat package; 44 leads (lead length 2.35 mm); body 14 x 14 x 2.2 mm
PCD5032
SOT205-1
c
y X
33 34
23 22 ZE
A
e E HE wM bp pin 1 index 44 1 11 ZD bp D HD wM B vM B 12 detail X L A A2 A1
Q (A 3) Lp
e
vM A
0
5 scale
10 mm
DIMENSIONS (mm are the original dimensions) UNIT mm A max. 2.60 A1 0.25 0.05 A2 2.3 2.1 A3 0.25 bp 0.50 0.35 c 0.25 0.14 D (1) 14.1 13.9 E (1) 14.1 13.9 e 1 HD 19.2 18.2 HE 19.2 18.2 L 2.35 Lp 2.0 1.2 Q 1.2 0.9 v 0.3 w 0.15 y 0.1 Z D (1) Z E (1) 2.4 1.8 2.4 1.8 7 0o
o
Note 1. Plastic or metal protrusions of 0.25 mm maximum per side are not included. OUTLINE VERSION SOT205-1 REFERENCES IEC 133E01A JEDEC EIAJ EUROPEAN PROJECTION
ISSUE DATE 92-11-17 95-02-04
1997 Apr 03
19
Philips Semiconductors
Product specification
ADPCM CODEC for digital cordless telephones
PCD5032
SO28: plastic small outline package; 28 leads; body width 7.5 mm
SOT136-1
D
E
A X
c y HE vMA
Z 28 15
Q A2 A1 pin 1 index Lp L 1 e bp 14 wM detail X (A 3) A
0
5 scale
10 mm
DIMENSIONS (inch dimensions are derived from the original mm dimensions) UNIT mm inches A max. 2.65 0.10 A1 0.30 0.10 A2 2.45 2.25 A3 0.25 0.01 bp 0.49 0.36 c 0.32 0.23 D (1) 18.1 17.7 0.71 0.69 E (1) 7.6 7.4 0.30 0.29 e 1.27 0.050 HE 10.65 10.00 0.42 0.39 L 1.4 0.055 Lp 1.1 0.4 0.043 0.016 Q 1.1 1.0 0.043 0.039 v 0.25 0.01 w 0.25 0.01 y 0.1 0.004 Z
(1)
0.9 0.4 0.035 0.016
0.012 0.096 0.004 0.089
0.019 0.013 0.014 0.009
8o 0o
Note 1. Plastic or metal protrusions of 0.15 mm maximum per side are not included. OUTLINE VERSION SOT136-1 REFERENCES IEC 075E06 JEDEC MS-013AE EIAJ EUROPEAN PROJECTION
ISSUE DATE 91-08-13 95-01-24
1997 Apr 03
20
Philips Semiconductors
Product specification
ADPCM CODEC for digital cordless telephones
14 SOLDERING 14.1 Introduction
PCD5032
If wave soldering cannot be avoided, the following conditions must be observed: * A double-wave (a turbulent wave with high upward pressure followed by a smooth laminar wave) soldering technique should be used. * The footprint must be at an angle of 45 to the board direction and must incorporate solder thieves downstream and at the side corners. Even with these conditions, do not consider wave soldering the following packages: QFP52 (SOT379-1), QFP100 (SOT317-1), QFP100 (SOT317-2), QFP100 (SOT382-1) or QFP160 (SOT322-1). 14.3.2 SO
There is no soldering method that is ideal for all IC packages. Wave soldering is often preferred when through-hole and surface mounted components are mixed on one printed-circuit board. However, wave soldering is not always suitable for surface mounted ICs, or for printed-circuits with high population densities. In these situations reflow soldering is often used. This text gives a very brief insight to a complex technology. A more in-depth account of soldering ICs can be found in our "IC Package Databook" (order code 9398 652 90011). 14.2 Reflow soldering
Reflow soldering techniques are suitable for all QFP and SO packages. The choice of heating method may be influenced by larger plastic QFP packages (44 leads, or more). If infrared or vapour phase heating is used and the large packages are not absolutely dry (less than 0.1% moisture content by weight), vaporization of the small amount of moisture in them can cause cracking of the plastic body. For more information, refer to the Drypack chapter in our "Quality Reference Manual" (order code 9397 750 00192). Reflow soldering requires solder paste (a suspension of fine solder particles, flux and binding agent) to be applied to the printed-circuit board by screen printing, stencilling or pressure-syringe dispensing before package placement. Several techniques exist for reflowing; for example, thermal conduction by heated belt. Dwell times vary between 50 and 300 seconds depending on heating method. Typical reflow temperatures range from 215 to 250 C. Preheating is necessary to dry the paste and evaporate the binding agent. Preheating duration: 45 minutes at 45 C. 14.3 14.3.1 Wave soldering QFP
Wave soldering techniques can be used for all SO packages if the following conditions are observed: * A double-wave (a turbulent wave with high upward pressure followed by a smooth laminar wave) soldering technique should be used. * The longitudinal axis of the package footprint must be parallel to the solder flow. * The package footprint must incorporate solder thieves at the downstream end. 14.3.3 METHOD (QFP AND SO)
During placement and before soldering, the package must be fixed with a droplet of adhesive. The adhesive can be applied by screen printing, pin transfer or syringe dispensing. The package can be soldered after the adhesive is cured. Maximum permissible solder temperature is 260 C, and maximum duration of package immersion in solder is 10 seconds, if cooled to less than 150 C within 6 seconds. Typical dwell time is 4 seconds at 250 C. A mildly-activated flux will eliminate the need for removal of corrosive residues in most applications. 14.4 Repairing soldered joints
Wave soldering is not recommended for QFP packages. This is because of the likelihood of solder bridging due to closely-spaced leads and the possibility of incomplete solder penetration in multi-lead devices.
Fix the component by first soldering two diagonallyopposite end leads. Use only a low voltage soldering iron (less than 24 V) applied to the flat part of the lead. Contact time must be limited to 10 seconds at up to 300 C. When using a dedicated tool, all other leads can be soldered in one operation within 2 to 5 seconds between 270 and 320 C.
1997 Apr 03
21
Philips Semiconductors
Product specification
ADPCM CODEC for digital cordless telephones
15 DEFINITIONS Data sheet status Objective specification Preliminary specification Product specification Limiting values
PCD5032
This data sheet contains target or goal specifications for product development. This data sheet contains preliminary data; supplementary data may be published later. This data sheet contains final product specifications.
Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or at any other conditions above those given in the Characteristics sections of the specification is not implied. Exposure to limiting values for extended periods may affect device reliability. Application information Where application information is given, it is advisory and does not form part of the specification. 16 LIFE SUPPORT APPLICATIONS These products are not designed for use in life support appliances, devices, or systems where malfunction of these products can reasonably be expected to result in personal injury. Philips customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such improper use or sale. 17 PURCHASE OF PHILIPS I2C COMPONENTS
Purchase of Philips I2C components conveys a license under the Philips' I2C patent to use the components in the I2C system provided the system conforms to the I2C specification defined by Philips. This specification can be ordered using the code 9398 393 40011.
1997 Apr 03
22
Philips Semiconductors
Product specification
ADPCM CODEC for digital cordless telephones
NOTES
PCD5032
1997 Apr 03
23
Philips Semiconductors - a worldwide company
Argentina: see South America Australia: 34 Waterloo Road, NORTH RYDE, NSW 2113, Tel. +61 2 9805 4455, Fax. +61 2 9805 4466 Austria: Computerstr. 6, A-1101 WIEN, P.O. Box 213, Tel. +43 1 60 101, Fax. +43 1 60 101 1210 Belarus: Hotel Minsk Business Center, Bld. 3, r. 1211, Volodarski Str. 6, 220050 MINSK, Tel. +375 172 200 733, Fax. +375 172 200 773 Belgium: see The Netherlands Brazil: see South America Bulgaria: Philips Bulgaria Ltd., Energoproject, 15th floor, 51 James Bourchier Blvd., 1407 SOFIA, Tel. +359 2 689 211, Fax. +359 2 689 102 Canada: PHILIPS SEMICONDUCTORS/COMPONENTS, Tel. +1 800 234 7381 China/Hong Kong: 501 Hong Kong Industrial Technology Centre, 72 Tat Chee Avenue, Kowloon Tong, HONG KONG, Tel. +852 2319 7888, Fax. +852 2319 7700 Colombia: see South America Czech Republic: see Austria Denmark: Prags Boulevard 80, PB 1919, DK-2300 COPENHAGEN S, Tel. +45 32 88 2636, Fax. +45 31 57 0044 Finland: Sinikalliontie 3, FIN-02630 ESPOO, Tel. +358 9 615800, Fax. +358 9 61580920 France: 4 Rue du Port-aux-Vins, BP317, 92156 SURESNES Cedex, Tel. +33 1 40 99 6161, Fax. +33 1 40 99 6427 Germany: Hammerbrookstrae 69, D-20097 HAMBURG, Tel. +49 40 23 53 60, Fax. +49 40 23 536 300 Greece: No. 15, 25th March Street, GR 17778 TAVROS/ATHENS, Tel. +30 1 4894 339/239, Fax. +30 1 4814 240 Hungary: see Austria India: Philips INDIA Ltd, Shivsagar Estate, A Block, Dr. Annie Besant Rd. Worli, MUMBAI 400 018, Tel. +91 22 4938 541, Fax. +91 22 4938 722 Indonesia: see Singapore Ireland: Newstead, Clonskeagh, DUBLIN 14, Tel. +353 1 7640 000, Fax. +353 1 7640 200 Israel: RAPAC Electronics, 7 Kehilat Saloniki St, PO Box 18053, TEL AVIV 61180, Tel. +972 3 645 0444, Fax. +972 3 649 1007 Italy: PHILIPS SEMICONDUCTORS, Piazza IV Novembre 3, 20124 MILANO, Tel. +39 2 6752 2531, Fax. +39 2 6752 2557 Japan: Philips Bldg 13-37, Kohnan 2-chome, Minato-ku, TOKYO 108, Tel. +81 3 3740 5130, Fax. +81 3 3740 5077 Korea: Philips House, 260-199 Itaewon-dong, Yongsan-ku, SEOUL, Tel. +82 2 709 1412, Fax. +82 2 709 1415 Malaysia: No. 76 Jalan Universiti, 46200 PETALING JAYA, SELANGOR, Tel. +60 3 750 5214, Fax. +60 3 757 4880 Mexico: 5900 Gateway East, Suite 200, EL PASO, TEXAS 79905, Tel. +9-5 800 234 7381 Middle East: see Italy Netherlands: Postbus 90050, 5600 PB EINDHOVEN, Bldg. VB, Tel. +31 40 27 82785, Fax. +31 40 27 88399 New Zealand: 2 Wagener Place, C.P.O. Box 1041, AUCKLAND, Tel. +64 9 849 4160, Fax. +64 9 849 7811 Norway: Box 1, Manglerud 0612, OSLO, Tel. +47 22 74 8000, Fax. +47 22 74 8341 Philippines: Philips Semiconductors Philippines Inc., 106 Valero St. Salcedo Village, P.O. Box 2108 MCC, MAKATI, Metro MANILA, Tel. +63 2 816 6380, Fax. +63 2 817 3474 Poland: Ul. Lukiska 10, PL 04-123 WARSZAWA, Tel. +48 22 612 2831, Fax. +48 22 612 2327 Portugal: see Spain Romania: see Italy Russia: Philips Russia, Ul. Usatcheva 35A, 119048 MOSCOW, Tel. +7 095 755 6918, Fax. +7 095 755 6919 Singapore: Lorong 1, Toa Payoh, SINGAPORE 1231, Tel. +65 350 2538, Fax. +65 251 6500 Slovakia: see Austria Slovenia: see Italy South Africa: S.A. PHILIPS Pty Ltd., 195-215 Main Road Martindale, 2092 JOHANNESBURG, P.O. Box 7430 Johannesburg 2000, Tel. +27 11 470 5911, Fax. +27 11 470 5494 South America: Rua do Rocio 220, 5th floor, Suite 51, 04552-903 Sao Paulo, SAO PAULO - SP, Brazil, Tel. +55 11 821 2333, Fax. +55 11 829 1849 Spain: Balmes 22, 08007 BARCELONA, Tel. +34 3 301 6312, Fax. +34 3 301 4107 Sweden: Kottbygatan 7, Akalla, S-16485 STOCKHOLM, Tel. +46 8 632 2000, Fax. +46 8 632 2745 Switzerland: Allmendstrasse 140, CH-8027 ZURICH, Tel. +41 1 488 2686, Fax. +41 1 481 7730 Taiwan: Philips Semiconductors, 6F, No. 96, Chien Kuo N. Rd., Sec. 1, TAIPEI, Taiwan Tel. +886 2 2134 2865, Fax. +886 2 2134 2874 Thailand: PHILIPS ELECTRONICS (THAILAND) Ltd., 209/2 Sanpavuth-Bangna Road Prakanong, BANGKOK 10260, Tel. +66 2 745 4090, Fax. +66 2 398 0793 Turkey: Talatpasa Cad. No. 5, 80640 GULTEPE/ISTANBUL, Tel. +90 212 279 2770, Fax. +90 212 282 6707 Ukraine: PHILIPS UKRAINE, 4 Patrice Lumumba str., Building B, Floor 7, 252042 KIEV, Tel. +380 44 264 2776, Fax. +380 44 268 0461 United Kingdom: Philips Semiconductors Ltd., 276 Bath Road, Hayes, MIDDLESEX UB3 5BX, Tel. +44 181 730 5000, Fax. +44 181 754 8421 United States: 811 East Arques Avenue, SUNNYVALE, CA 94088-3409, Tel. +1 800 234 7381 Uruguay: see South America Vietnam: see Singapore Yugoslavia: PHILIPS, Trg N. Pasica 5/v, 11000 BEOGRAD, Tel. +381 11 625 344, Fax.+381 11 635 777
For all other countries apply to: Philips Semiconductors, Marketing & Sales Communications, Building BE-p, P.O. Box 218, 5600 MD EINDHOVEN, The Netherlands, Fax. +31 40 27 24825 (c) Philips Electronics N.V. 1997
Internet: http://www.semiconductors.philips.com
SCA54
All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner. The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license under patent- or other industrial or intellectual property rights.
Printed in The Netherlands
437027/1200/02/pp24
Date of release: 1997 Apr 03
Document order number:
9397 750 01525

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